SANTA CLARA – In the evolving semiconductor industry, Intel CEO Pat Gelsinger said the company's next processing node could outperform rival Taiwan Semiconductor's (TSMC) future chips. As the two tech giants work to advance smaller semiconductor nodes, they are at the forefront of innovation and plan to mass-produce advanced chips in the coming years.
Intel is preparing to introduce new technologies, including its RibbonFET architecture, as part of its strategy to advance semiconductor manufacturing. The company is targeting the introduction of this new semiconductor technology by the end of 2024. RibbonFET is Intel's first new transistor architecture since the introduction of FinFET in 2011 and promises significant improvements in transistor performance and efficiency.
On the other side of the competition, TSMC has set its roadmap and aims to mass-produce its N3P node by the end of 2024. Additionally, TSMC plans to develop its N2 node in 2025. These advances represent critical steps for TSMC moving forward to push the boundaries of chip performance and energy efficiency.
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