Two giants face each other: Qualcomm and MediaTek. These ARM chip designers just introduced two new chips almost simultaneously. We take stock.
Source: a nice montage from Frandroid
Qualcomm’s new Snapdragon 7 Gen 3
THE Snapdragon 7 Gen 3Although the name suggests a simple evolution, it is still very different from its predecessor, the SD 7+ Gen 2. It was developed using TSMC’s 4nm process technology and has a 1+3+4 CPU Layout. Its Kryo processor has a main core at 2.63 GHz, accompanied by 3 performance cores at 2.4 GHz and 4 efficiency cores at 1.8 GHz.
Qualcomm claims that the Snapdragon 7 Gen 3 outperforms its predecessor with a 15 percent improvement in CPU performance and an Adreno GPU that is 50 percent faster than that of the Snapdragon 7 Gen 1. In terms of power savings, the 7th generation chip would .Generation 3 achieves a further 20% savings.
Source: Qualcomm
The Hexagon NPU integrated into the SD 7 Gen 3 promises 60% better AI performance per watt than the SD 7 Gen 1 and supports the OpenGL ES 3.2, OpenCL 2.0 FP and Vulkan 1.3 APIs. Display support extends up to 4K resolution at 60 Hz or FHD+ at 168 Hz. The Snapdragon 7 Gen 3 is equipped with a Qualcomm Spectra ISP that handles main camera modules with up to 200 megapixels and 4K HDR videos with 60 frames per Second can record.
This new SoC is paired with the Snapdragon 5.3. The first devices equipped with this chip, including from Honor and Vivo, are expected this month.
MediaTek counters with the Dimensity 8300
MediaTek is fighting back with this Dimensions 8300, presented as “ultra-efficient” and significantly more efficient than its predecessor. It combines modern ARM Cortex-A715 and Cortex-A510 cores with a Mali-G615 GPU, all made in 4nm.
The Dimensity 8300 consists of four ARM Cortex-A715 performance cores, one of which reaches 3.35 GHz and the other three 3.2 GHz, as well as four ARM Cortex-A510 efficiency cores at 2.2 GHz. MediaTek claims that this configuration offers 20% more performance and 30% lower power consumption compared to the Dimensity 8200. Its new ARM Mali-G615 MC6 GPU would score 60% higher in GFXBench Manhattan 3.0 with 55% lower power consumption. .
Source: MediaTek
The integrated APU 780 is said to be able to run generative AI software eight times faster, with twice the floating point performance compared to the previous model. The Dimensity 8300 supports LPDDR5x 8533 memory and UFS 4.0 MCQ flash storage.
This chip also integrates a mmWave-compatible 5G modem, Wi-Fi 6E, Bluetooth 5.4, and supports hardware-accelerated HEVC encoding. It’s compatible with QHD+ 120Hz or 1080p+ at 180Hz displays, cameras up to 320MP, and 4K video recording at 60fps. 4nm production, combined with a modernized architecture, would reduce in-game power consumption by 25%; At low loads, this consumption drops by at least 11%. Just like Qualcomm, it won’t be long before the first smartphones are equipped with this chip.
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